Reinforcing bond covalency for high thermoelectric performance in Cu3SbSe4-based thermoelectric material
Dan Zhang, Ruiqi Zhong, Shikang Gao, Lei Yang, Fang Xu, Ping He, Guannan Liu, Xingyuan San, Junyou Yang, Yubo Luo, Shufang Wang
Topics & Concepts
Thermoelectric effectMaterials scienceCoupling (piping)Thermoelectric materialsElectron mobilityFigure of meritPhononSeebeck coefficientCondensed matter physicsNanotechnologyOptoelectronicsThermodynamicsMetallurgyComposite materialThermal conductivityPhysicsAdvanced Thermoelectric Materials and DevicesThermal properties of materialsPerovskite Materials and Applications