Acoustic residual softening and microstructure evolution of T2 copper foil in ultrasonic vibration assisted micro-tension
Yang Liu, Chunju Wang, Rengui Bi
Topics & Concepts
Materials scienceSofteningResidual stressComposite materialUltrasonic sensorMicrostructureDislocationElectron backscatter diffractionAcousticsPhysicsMicrostructure and mechanical propertiesMetal Forming Simulation TechniquesHigh-Velocity Impact and Material Behavior