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Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation

Shan Xu, Ancang Yang, Yonghua Duan, Mengnie Li, Mingjun Peng

2023Materials Today Communications11 citationsDOI

Topics & Concepts

Materials scienceFracture toughnessDopingThermal conductivityElastic modulusAnisotropyAtom (system on chip)AlloyComposite materialToughnessCovalent bondCrystallographyPhysicsComputer scienceChemistryEmbedded systemQuantum mechanicsOptoelectronicsElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies
Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation | Litcius