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Multi-field coupling in designing embedded microchannels for three-dimensional integrated chip: A topology optimization approach

Wei He, Jianhong Zhou, Xuemei Chen, Jiaqi Li, Qiang Li

2024Applied Thermal Engineering31 citationsDOI

Topics & Concepts

MicrochannelTopology optimizationPressure dropTopology (electrical circuits)Heat transferCoupling (piping)Materials scienceThree-dimensional integrated circuitMechanical engineeringElectronic engineeringMechanicsEngineeringFinite element methodIntegrated circuitNanotechnologyPhysicsElectrical engineeringStructural engineeringOptoelectronicsHeat Transfer and OptimizationAdvanced Multi-Objective Optimization AlgorithmsThermal Radiation and Cooling Technologies
Multi-field coupling in designing embedded microchannels for three-dimensional integrated chip: A topology optimization approach | Litcius