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Enhanced cooling performance of stacked chips by structural modification for fractal micro-protrusions

Rong Li, Ziyue Wang, Zhanbin Wu, Jing Ni, Lihua He, Ming Xiong, Min Kong, Juyong Zhang

2023Applied Thermal Engineering13 citationsDOI

Topics & Concepts

Materials scienceFractalMechanical engineeringNanotechnologyComposite materialEngineering physicsEngineeringMathematicsMathematical analysisHeat Transfer and OptimizationTribology and Lubrication EngineeringHeat Transfer Mechanisms
Enhanced cooling performance of stacked chips by structural modification for fractal micro-protrusions | Litcius