A 256Gb/s/mm-shoreline AIB-Compatible 16nm FinFET CMOS Chiplet for 2.5D Integration with Stratix 10 FPGA on EMIB and Tiling on Silicon Interposer
Chester Liu, Jacob Botimer, Zhengya Zhang
Abstract
This work presents an Advanced Interface Bus (AIB)-compatible microcontroller unit (MCU) chiplet in 16nm FinFET CMOS. The MCU chiplet consists of three AIB channels, each providing 20 Tx and Rx pairs to support 80Gb/s/channel over 55μm - pitch microbumps. Two multi-chip modules (MCM) were constructed, one made of two MCU chiplets integrated on a 180nm passive silicon interposer, and the other made by pairing an MCU chiplet with a Stratix 10 FPGA over an Embedded Multi-die Interconnect Bridge (EMIB). The AIB interface provides 256Gb/s/mm-shoreline, consuming 0.83pJ/b at 0.9V and 1GHz. The two MCMs demonstrate the ease and versatility of modular 2.5D integration.
Topics & Concepts
MicrocontrollerField-programmable gate arrayInterposerEmbedded systemComputer scienceCMOSInterface (matter)Modular designChipSystem on a chipComputer hardwareEngineeringMaterials scienceElectrical engineeringParallel computingOperating systemNanotechnologyEtching (microfabrication)BubbleMaximum bubble pressure methodLayer (electronics)Photonic and Optical DevicesSemiconductor Lasers and Optical DevicesSemiconductor materials and devices