Thermal interface materials for cooling microelectronic systems: present status and future challenges
Ramakrishna Devananda Pathumudy, K. Narayan Prabhu
Topics & Concepts
MicroelectronicsHeat sinkInterface (matter)Heat transferMiniaturizationThermalMechanical engineeringThermal resistanceMaterials scienceComputer scienceEngineering physicsProcess engineeringNanotechnologyEngineeringComposite materialMechanicsCapillary numberPhysicsMeteorologyCapillary actionThermal properties of materialsHeat Transfer and OptimizationThermal Expansion and Ionic Conductivity