Litcius/Paper detail

Improving heat dissipation characteristics of concurrent flow through a novel mini- and micro-channel stacked double-layer heat sink

C.J. Ho, Jr-Wei Liao, Bo-Lin Chen, Saman Rashidi, Wei‐Mon Yan

2025Applied Thermal Engineering11 citationsDOI

Topics & Concepts

Heat sinkMaterials scienceDissipationChannel (broadcasting)Thermal management of electronic devices and systemsSink (geography)Flow (mathematics)Heat flowMechanicsMechanical engineeringEngineeringElectrical engineeringThermodynamicsThermalPhysicsCartographyGeographyHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms
Improving heat dissipation characteristics of concurrent flow through a novel mini- and micro-channel stacked double-layer heat sink | Litcius