A Review of Interface Microstructures in Electronic Packaging Applications: Brazing and Welding Technologies
Paul T. Vianco
Topics & Concepts
BrazingMaterials scienceSolderingWeldingReliability (semiconductor)MicrostructureMetallurgyInterface (matter)Electronic packagingFiller metalJoint (building)Mechanical engineeringWettingComposite materialAlloyEngineeringArc weldingStructural engineeringPhysicsPower (physics)Quantum mechanicsSessile drop techniqueElectronic Packaging and Soldering TechnologiesSurface Modification and SuperhydrophobicityAdhesion, Friction, and Surface Interactions