Litcius/Paper detail

Surface characteristics of phenolic resin coatings

Luuk Moone, M.P.J. Donners, Kurt Van Durme, D.V. Okhrimenko, Rolf A. T. M. van Benthem, Remco Tuinier, A. Catarina C. Esteves

2024Surfaces and Interfaces20 citationsDOIOpen Access PDF

Abstract

Phenolic resins are commonly used as polymer binders for metal, paper and mineral wool substrates. For such applications, mechanical, adhesive and thermal properties are considered most important, and the effect of synthesis and structural parameters on such end-use characteristics are well-documented. However, surface characteristics of cured phenolic resins can be equally relevant and are often overlooked. Widely used resins are phenol-urea-formaldehyde (PUF) and phenol-formaldehyde (PF). It is believed that the inherent chemistry and curing procedure of these resins result in coatings with distinct surface properties and wettability. To gain more insight into surface characteristics such as morphology, chemical composition and wettability of cured PUF and PF resins, different binder formulations were applied on glass substrates and subsequently characterised by Scanning Electron Microscopy (SEM), Contact Angle Goniometry (CAG) and X-Ray Photoelectron Spectroscopy (XPS). The effect of catalyst, chemical composition and curing conditions on surface characteristics of various PUF and PF coatings were investigated. The curing temperature was found to have a strong influence on surface properties; curing at 200°C yields a surface with varying degrees of oxidation, differences in linkages between phenolic and urea species, and a lower overall nitrogen content in case of urea-containing coatings, resulting in stronger fluctuations in water-wettability compared to surfaces hardened at lower temperatures.

Topics & Concepts

WettingMaterials scienceContact angleCuring (chemistry)X-ray photoelectron spectroscopyAdhesiveUrea-formaldehydePhenolChemical engineeringScanning electron microscopePolymerSurface energyComposite materialOrganic chemistryChemistryEngineeringLayer (electronics)Epoxy Resin Curing ProcessesMaterial Properties and ProcessingPolymer composites and self-healing