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Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy

Xinjiang Liao, Zhuo Liu, Ruixiang Liu, Dekui Mu

2022Diamond and Related Materials14 citationsDOI

Topics & Concepts

BrazingMaterials scienceEutectic systemMicrostructureAlloyDiamondMetallurgyComposite materialAdvanced materials and compositesTunneling and Rock MechanicsAdvanced machining processes and optimization
Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy | Litcius