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Insight into the atomic-scale material removal of 4H-SiC electrochemical mechanical polishing (ECMP) using graphene oxide

Zirui Wang, Yuguang Zhu, Ronghao Ren, Tianyu Zhang, Yang Peng, Yongguang Wang, Xiaolong Lu, C.M. Wang

2025Tribology International13 citationsDOI

Topics & Concepts

GraphenePolishingOxideElectrochemistryAtomic unitsMaterials scienceChemical-mechanical planarizationScale (ratio)Composite materialNanotechnologyMetallurgyChemistryElectrodePhysicsPhysical chemistryQuantum mechanicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis
Insight into the atomic-scale material removal of 4H-SiC electrochemical mechanical polishing (ECMP) using graphene oxide | Litcius