Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
Hongfei Tao, Qinyang Zeng, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
WaferMaterials sciencePolishingChemical-mechanical planarizationSiliconGrindingComposite materialCorrosionMetallurgyOptoelectronicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research