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The effect of ethylenediamine tetramethylphosphonic acid on the chemical mechanical polishing of TSV barrier layer

Xuhua Chen, Yanwei Dong, Ru Wang, Tao Zheng, Zhangjie Du, Jinxiang Huo

2024Colloids and Surfaces A Physicochemical and Engineering Aspects15 citationsDOI

Topics & Concepts

PolishingTantalumMaterials scienceChemical-mechanical planarizationX-ray photoelectron spectroscopyScanning electron microscopeSurface roughnessLayer (electronics)BrassCopperComposite materialChemical engineeringAnalytical Chemistry (journal)MetallurgyChemistryChromatographyEngineeringAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisAdvanced Machining and Optimization Techniques
The effect of ethylenediamine tetramethylphosphonic acid on the chemical mechanical polishing of TSV barrier layer | Litcius