A novel thermal management scheme of 3D-IC based on loop heat pipe
Dongfang Zhou, Yan Chen, Wei Gao, Gongming Xin
Topics & Concepts
Thermal management of electronic devices and systemsThree-dimensional integrated circuitMaterials scienceInterconnectionHeat fluxHeat pipeHeat sinkLoop heat pipeThermalIntegrated circuitThermal conductivityMechanical engineeringCapillary actionChipHeat transferComputer scienceOptoelectronicsMechanicsComposite materialEngineeringPhysicsThermodynamicsTelecommunications3D IC and TSV technologiesThin-Film Transistor TechnologiesAdvancements in Photolithography Techniques