Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion
Zimeng He, Shan Huang, Xialei Lv, Jinhui Li, Guoping Zhang, Rong Sun
Topics & Concepts
Pyromellitic dianhydrideMaterials scienceThermal expansionAdhesionUltimate tensile strengthCopperDiamineMonomerPolymer chemistryComposite materialChemical engineeringPolyimidePolymerLayer (electronics)MetallurgyEngineeringSynthesis and properties of polymersTribology and Wear AnalysisEpoxy Resin Curing Processes