Stress-induced warpage estimation of advanced semiconductor copper interconnect processes
Chang‐Chun Lee, Yen-Hung Lin, Dei-Pei Yang
Topics & Concepts
InterconnectionMaterials scienceStress (linguistics)CopperSemiconductorElectronic engineeringStructural engineeringMetallurgyReliability engineeringComposite materialOptoelectronicsEngineeringTelecommunicationsLinguisticsPhilosophyIntegrated Circuits and Semiconductor Failure AnalysisAdvanced Surface Polishing Techniques3D IC and TSV technologies