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Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Zih-You Wu, Tzu-Chia Wang, Yu-Ching Wang, Rui-Wen Song, Su-Yueh Tsai, Jenq‐Gong Duh

2022Journal of Materials Science Materials in Electronics17 citationsDOI

Topics & Concepts

Materials scienceKirkendall effectIntermetallicMicrostructureLiquid phasePhase (matter)ToughnessComposite materialMechanical strengthMetallurgyCopperMelting pointSolderingPhysicsOrganic chemistryChemistryAlloyThermodynamicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies
Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging | Litcius