Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components
Wenqian Li, Xinda Wang, Ruiqian Zheng, Xiaohui Zhao, Hao Zheng, Zhiyan Zhao, Mengxuan Cheng, Yong Jiang, Yuxi Jia
Topics & Concepts
Reliability (semiconductor)Coupling (piping)Finite element methodPhysics of failureReliability engineeringField (mathematics)EngineeringComputer scienceMaterials sciencePhysicsMechanical engineeringMathematicsStructural engineeringQuantum mechanicsPower (physics)Pure mathematicsElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure Analysis3D IC and TSV technologies