Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
Xingyu Dai, Xin Yang, Xinlong Wu, Chunming Tu, Guoyou Liu
Topics & Concepts
Wire bondingInsulated-gate bipolar transistorFinite element methodStructural engineeringStress (linguistics)BondMaterials scienceReliability (semiconductor)Displacement (psychology)Power (physics)Mechanical engineeringEngineeringElectrical engineeringVoltagePhysicsPhilosophyChipPsychotherapistQuantum mechanicsPsychologyLinguisticsFinanceEconomicsSilicon Carbide Semiconductor TechnologiesThin-Film Transistor TechnologiesSilicon and Solar Cell Technologies