Preparation of Ultra-thin Copper Foil with Low Profile and High Tensile Strength on Surface of 18-µm Carrier Copper Foil
Yao Liu, Ning Song, Xiao‐Wei Fan, Binghu Lu, D. X. Li, Lijuan Wang, Zhen Sun, Yun‐Zhi Tang
Topics & Concepts
Materials scienceFOIL methodCopperUltimate tensile strengthSurface roughnessSurface finishComposite materialScanning electron microscopeMicrostructureMetallurgyTexture (cosmology)Computer scienceArtificial intelligenceImage (mathematics)Nanomaterials and Printing TechnologiesElectrodeposition and Electroless CoatingsAdvanced Sensor and Energy Harvesting Materials