Die attachment, wire bonding, and encapsulation process in LED packaging: A review
Md Abdul Alim, M.Z. Abdullah, Mohd Sharizal Abdul Aziz, Roslan Kamarudin
Topics & Concepts
Light-emitting diodePhosphorMaterials scienceEncapsulation (networking)Thermal management of electronic devices and systemsNanotechnologyCoatingWire bondingEngineering physicsOptoelectronicsComputer scienceMechanical engineeringEngineeringTelecommunicationsChipComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesGaN-based semiconductor devices and materials