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Interfacial bonding mechanism and fracture behavior in ultrasonic spot welding of copper sheets

Zenglei Ni, Y. Liu, Y.H. Wang, Bolin He

2021Materials Science and Engineering A44 citationsDOI

Topics & Concepts

Materials scienceWeldingMicrostructureMetallurgyRecrystallization (geology)Composite materialSpot weldingGrain sizeUltrasonic weldingHeat-affected zoneFracture (geology)Dynamic recrystallizationGrain boundaryHot workingPaleontologyBiologyAdvanced Welding Techniques AnalysisAluminum Alloys Composites PropertiesMicrostructure and mechanical properties
Interfacial bonding mechanism and fracture behavior in ultrasonic spot welding of copper sheets | Litcius