Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Ronald J. Warzoha, Adam A. Wilson, Brian Donovan, Nazlı Dönmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan G. Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura B. Ruppalt
Abstract
Abstract This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and two-dimensional materials, and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including radio frequency (RF) electronics and neuromorphic computing.