Preparation of diamond/copper composites modified by Ti3C2Tx as interlayer with enhanced thermal conductivity
Huaijie Cao, Ding‐Bang Xiong
Topics & Concepts
Composite numberMaterials scienceComposite materialCopperDiamondThermal conductivityMicrostructureAnnealing (glass)Layer (electronics)MetallurgyMXene and MAX Phase MaterialsAluminum Alloys Composites PropertiesFerroelectric and Negative Capacitance Devices