Study on picosecond laser stealth dicing of 4H-SiC along [ <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si5.svg"> <mml:mn>11</mml:mn> <mml:mover> <mml:mn>2</mml:mn> <mml:mo>¯</mml:mo> </mml:mover> <mml:mn>0</mml:mn> </mml:math> ] and [ <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si6.svg"> <mml:mn>1</mml:mn> <mml:mover> <mml:mn>1</mml:mn> <mml:mo>¯</mml:mo> </mml:mover> <mml:mn>00</mml:mn> </mml:math> ] crystal orientations on Si-face and C-face
Qiuling Wen, Ye Yang, Jing Lu, Hui Huang, Changcai Cui
Topics & Concepts
Wafer dicingMaterials scienceLaserLaser ablationCrystal (programming language)Orientation (vector space)BendingOpticsWaferOptoelectronicsGeometryComposite materialComputer sciencePhysicsMathematicsProgramming languageAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisLaser Material Processing Techniques