Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining
Kosuke Takenaka, Akiya Jinda, Soutaro Nakamoto, Ryosuke Koyari, Susumu Toko, Giichiro Uchida, Yuichi Setsuhara
Abstract
Abstract The direct bonding of A5052 aluminum (Al) alloy to the engineering polymer poly(ether ether ketone) (PEEK) using an atmospheric pressure plasma-assisted process was demonstrated. The effect of plasma irradiation on the bonding surface of metal resin on the bonding strength following thermal press fitting method was investigated. Specimens bonded by plasma irradiation on the PEEK surface only showed a high tensile shear stress of 15.5 MPa. With increasing plasma irradiation time, the bond strength of the samples bonded to the PEEK surface by plasma irradiation increased. The increase in the bond strength between metals and polymers following direct bonding is caused by the addition of oxygen functional groups on the polymer. In contrast, specimens in which only the Al was exposed to the plasma showed a decrease in bond strength compared with unirradiated samples. This reduction in bond strength is attributed to the forming magnesium oxide, which forms in the early stages of participation due to plasma irradiation.