Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging
Qiang Jia, Guisheng Zou, Hongqiang Zhang, Wengan Wang, Hui Ren, A Zhanwen, Zhongyang Deng, Shaohua Yan, Daozhi Shen, Lei Liu
Topics & Concepts
Materials scienceAlloySinteringLayer (electronics)Ionic bondingChemical engineeringNanoparticlePalladiumComposite materialElectrochemistrySurface layerNanotechnologyPhysical chemistryChemistryIonOrganic chemistryCatalysisEngineeringElectrodeNanomaterials and Printing TechnologiesElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless Coatings