Litcius/Paper detail

Structural, electronic, mechanical, and thermodynamic properties of Cu–Ti intermetallic compounds: First-principles calculations

Yang Xu, Meiling Tian, Changyi Hu, Zhaohui Han, Shenggang Zhou, Yong Cao

2022Solid State Communications39 citationsDOI

Topics & Concepts

IntermetallicDebye modelEnthalpyThermodynamicsMaterials scienceBulk modulusDensity functional theoryChemical stabilityPhysical chemistryChemistryComputational chemistryMetallurgyAlloyPhysicsMXene and MAX Phase MaterialsIntermetallics and Advanced Alloy PropertiesBoron and Carbon Nanomaterials Research