Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization
Sanghuck Jeon, Jungryul Lee, Seok‐Jun Hong, Hyeonmin Seo, Yeongkwang Cho, Pengzhan Liu, Ki‐Hong Park, Taesung Kim
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceAsperity (geotechnical engineering)Abrasion (mechanical)SlurryAbrasiveConsumablesTribologyWaferComposite materialOxideMetallurgyLayer (electronics)NanotechnologyMarketingBusinessAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdhesion, Friction, and Surface Interactions