Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
Marius van Dijk, Saskia Huber, Andreas Stegmaier, H. Walter, Olaf Wittler, Martin Schneider‐Ramelow
Topics & Concepts
Materials scienceShrinkageWaferMaterial propertiesMechanical engineeringComposite materialEpoxyMoldThermal expansionProcess (computing)Computer scienceEngineeringOperating systemNanotechnologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced MEMS and NEMS Technologies