Litcius/Paper detail

Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry

Wenxiang Xie, Zhenyu Zhang, Li Wang, Xiangxiang Cui, Shiqiang Yu, Hongjiu Su, Shudong Wang

2023Journal of Manufacturing Processes43 citationsDOI

Topics & Concepts

Materials scienceWaferChemical-mechanical planarizationSlurryColloidal silicaSiliconPolishingChemical engineeringDispersitySurface roughnessDissolutionColloidComposite materialNanotechnologyMetallurgyPolymer chemistryCoatingEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications