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Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5

Ancang Yang, Yonghua Duan, Caiju Li, Jianhong Yi, Mingjun Peng

2021Intermetallics50 citationsDOI

Topics & Concepts

Materials scienceDopingFracture toughnessThermal conductivityAnisotropyDuctility (Earth science)Composite materialToughnessThermal stabilityConductivityCreepChemical engineeringPhysical chemistryOptoelectronicsOpticsPhysicsEngineeringChemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies
Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5 | Litcius