Enhancing capillary performance of copper wicks by electrodeposition of superhydrophilic dendritic structures
En-Chia Liu, Jui-Cheng Yu, Chao-Yang Chiang, Chien‐Neng Liao
Topics & Concepts
Contact angleMaterials scienceWettingCapillary actionPorosityCopperScanning electron microscopeSubstrate (aquarium)Chemical engineeringSurface roughnessSuperhydrophilicityComposite materialMetallurgyOceanographyEngineeringGeologyFluid Dynamics and Thin FilmsNanomaterials and Printing Technologies