Diffusion bonding criterion based on real surface asperities: Modeling and validation
Huiping Wu, Wenbing Yang, Heli Peng, Xifeng Li, Jun Chen
Topics & Concepts
Materials scienceVoid (composites)WavelengthDiffusionMechanicsClosure (psychology)Composite materialThermodynamicsPhysicsMarket economyEconomicsOptoelectronicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetal Forming Simulation Techniques