Litcius/Paper detail

Three-dimensional numerical manifold method for heat conduction problems with a simplex integral on the boundary

Defu Tong, Xiongwei Yi, Fei Tan, Yu‐Yong Jiao, Jiawei Liang

2023Science China Technological Sciences25 citationsDOI

Topics & Concepts

Thermal conductionMathematicsGalerkin methodBoundary (topology)Integral equationBoundary value problemTransient (computer programming)Scalar (mathematics)Heat equationMathematical analysisManifold (fluid mechanics)Numerical analysisGeometryFinite element methodComputer sciencePhysicsMechanical engineeringEngineeringThermodynamicsOperating systemNumerical methods in engineeringElectromagnetic Simulation and Numerical MethodsAdvanced Numerical Methods in Computational Mathematics