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X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide

Hokyoung Jung, Seonho Jeong, Youngwook Park, Yeongil Shin, Haedo Jeong

2022International Journal of Precision Engineering and Manufacturing19 citationsDOI

Topics & Concepts

Full width at half maximumPolishingMaterials scienceScanning electron microscopeSilicon carbideSurface roughnessTransmission electron microscopyLayer (electronics)DiffractionSurface finishSiliconOpticsComposite materialAnalytical Chemistry (journal)NanotechnologyMetallurgyOptoelectronicsChemistryPhysicsChromatographyAdvanced Surface Polishing TechniquesMetal and Thin Film MechanicsIntegrated Circuits and Semiconductor Failure Analysis
X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide | Litcius