Atomic-Resolution Interfacial Reaction Mechanism between Bi<sub>2</sub>Te<sub>3</sub>-Based Alloys and Ni Electrodes
Zefan Xue, Weichao Lu, Wenjun Cui, Weixiao Lin, Congli Sun, Xiahan Sang
Abstract
Interdiffusion and solid–solid phase reaction at the interface between thermoelectric (TE) materials and the electrode critically influence interfacial transport properties and the overall energy conversion efficiency during service. Here, the microstructural evolution and diffusion mechanisms at the interfaces between the most widely used Bi 2 Te 3 -based TE materials, n-type Bi 2 Te 2.7 Se 0.3 (BTS) and p-type Bi 0.5 Sb 1.5 Te 3 (BST), and Ni electrodes were investigated at atomic resolution using spherical aberration-corrected scanning transmission electron microscopy (STEM). The BTS(0001)/Ni and BST(0001)/Ni interfaces were constructed by depositing Ni nanoparticles on mechanically exfoliated BTS and BST bulk materials and subsequent annealing. The interfacial reaction is initially dominated by Ni diffusion into the TE matrix to form NiAs-type NiM intermetallics, while Ni trans-quintuple-layer diffusion only occurs in Sb-rich BST. The Bi-rich BTS is more influenced by the Ni–Te preferential reaction, resulting in NiM abnormal grain growth and the formation of tilted and rotated interfaces. Bi diffusion into the BTS matrix forms a Bi double layer at the interface or Bi 2 [Bi 2 (Te,Se) 3 ] as the annealing temperature increases, while Bi diffusion into the Ni thin film greatly accelerates the interfacial reaction rate, as elucidated by in situ heating STEM. The results provide essential structural details to understand and prevent the degradation of TE device performance.