Flip-chip solder bumps defect detection using a self-search lightweight framework
Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael Pecht
Topics & Concepts
Flip chipSolderingThermal copper pillar bumpChipMaterials scienceIntegrated circuit packagingElectronic engineeringComputer scienceEmbedded systemIntegrated circuitEngineeringOptoelectronicsElectrical engineeringNanotechnologyComposite materialAdhesiveLayer (electronics)Industrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure AnalysisImage Processing Techniques and Applications