Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

Kun-Lin Tsai, Chih‐Ming Chen, Cheng–En Ho

2024Journal of the Taiwan Institute of Chemical Engineers21 citationsDOI

Topics & Concepts

CopperSolderingImpurityMaterials scienceMetallurgyChemistryOrganic chemistryElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsSemiconductor materials and interfaces