Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation
Eungchul Kim, Jiah Hong, Seok‐Jun Hong, Chaitanya Kanade, Hyunho Seok, Hyeong‐U Kim, Taesung Kim
Topics & Concepts
X-ray photoelectron spectroscopyMaterials scienceSlurryChemical-mechanical planarizationOxidePolishingIrradiationUltravioletOxygenChemical engineeringMetallurgyChemistryComposite materialOptoelectronicsEngineeringOrganic chemistryPhysicsNuclear physicsAdvanced Nanomaterials in CatalysisElectronic and Structural Properties of OxidesAdvanced Surface Polishing Techniques