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Influence of Sample Tilt and Applied Load on Microscratch Behavior of Copper Under a Spherical Diamond Indenter

Ming Liu

2021Tribology Letters22 citationsDOI

Topics & Concepts

Materials scienceScratchGroove (engineering)DiamondComposite materialPenetration depthPenetration (warfare)ResidualCopperOpticsMetallurgyComputer scienceAlgorithmPhysicsOperations researchEngineeringMetal and Thin Film MechanicsAdvanced Surface Polishing TechniquesAdhesion, Friction, and Surface Interactions
Influence of Sample Tilt and Applied Load on Microscratch Behavior of Copper Under a Spherical Diamond Indenter | Litcius