Liquid bridge: liquid metal bridging spherical BN largely enhances the thermal conductivity and mechanical properties of thermal interface materials
Junhong Li, Qiang‐Qiang Ma, Shan Gao, Ting Liang, Yunsong Pang, Xiangliang Zeng, Yayun Li, Xiaoliang Zeng, Rong Sun, Linlin Ren
Abstract
With the rapid development of advanced microelectronic equipment, thermal interface materials with high thermal conductivity and excellent mechanical properties have become an urgent need.
Topics & Concepts
Materials scienceThermal conductivityMicroelectronicsBridging (networking)Thermal greaseThermalLiquid metalComposite materialThermal bridgeMetalInterface (matter)NanotechnologyThermal insulationMetallurgyLayer (electronics)Computer sciencePhysicsMeteorologyCapillary numberComputer networkCapillary actionThermal properties of materialsAdvanced ceramic materials synthesisHeat Transfer and Optimization