Nanosecond laser irradiation assisted chemical mechanical polishing (CMP) process for promoting material removal of single crystal 4H–SiC
Zirui Wang, Yongguang Wang, Haidong He, Feng Chen, Jiacen Shi, Jiacen Shi, Tianyu Zhang, Rui Zhu, Rui Zhu
Topics & Concepts
Materials scienceChemical-mechanical planarizationIrradiationPolishingSingle crystalNanosecondLaserComposite materialProcess (computing)OptoelectronicsOpticsCrystallographyNuclear physicsPhysicsComputer scienceChemistryOperating systemAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis