Interfacial engineering of epoxy/silica nanocomposites by amino-rich polyethyleneimine towards simultaneously enhanced rheological and thermal-mechanical performance for electronic packaging application
Qian Guo, Gang Li, Pengli Zhu, Zhen Xu, Tao Zhao, Rong Sun, Ching‐Ping Wong
Topics & Concepts
EpoxyRheologyNanocompositeMaterials scienceComposite materialThermalElectronic packagingPhysicsMeteorologyPolymer Nanocomposites and PropertiesPolymer composites and self-healingAdvanced Sensor and Energy Harvesting Materials