Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM<sub>1+x</sub>Sn<sub>1−x</sub>S<sub>4</sub> (M = Ti, V, Cr, Co)]
Cédric Bourgès, Bhuvanesh Srinivasan, Bruno La Fontaine, Philipp Sauerschnig, Alizée Minard, Jean‐François Halet, Yuzuru Miyazaki, David Berthebaud, Takao Mori
Abstract
The thermoelectric properties of a series of Cu–Sn based thiospinel compounds by screening a variety of transition elements (M = Ti, V, Cr, Co) as a potential substituent at the Sn-site (both p- and n-type thiospionels) are reported and discussed.
Topics & Concepts
Materials scienceThermoelectric effectSubstituentCrystallographyStereochemistryChemistryPhysicsThermodynamicsAdvanced Thermoelectric Materials and DevicesChalcogenide Semiconductor Thin FilmsThermal Expansion and Ionic Conductivity