Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy
Duy Le Han, Yu-An Shen, Siliang He, Hiroshi Nishikawa
Topics & Concepts
Materials scienceAlloyEutectic systemMicrostructureUltimate tensile strengthPhase (matter)Ternary operationMetallurgyElongationAtmospheric temperature rangeThermodynamicsChemistryOrganic chemistryProgramming languagePhysicsComputer scienceElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesSilicon and Solar Cell Technologies