A Full-component recyclable Epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability
Jingkai Liu, Haoyang Feng, Jinyue Dai, Kerong Yang, Guangmeng Chen, Shuaipeng Wang, Dandan Jin, Xiaoqing Liu, Xiaoqing Liu
Topics & Concepts
Materials scienceEpoxyThermal conductivityComposite materialBoron nitrideComposite numberThermal greaseHot pressingThermal properties of materialsGraphene research and applicationsAerogels and thermal insulation