HfO<sub>2</sub> Area-Selective Atomic Layer Deposition with a Carbon-Free Inhibition Layer
Yujin Lee, Seunggi Seo, Alexander B. Shearer, Andreas Werbrouck, Hyungjun Kim, Stacey F. Bent
Abstract
Area-selective atomic layer deposition (AS-ALD) is a bottom-up materials synthesis process that provides the opportunity to overcome challenges associated with current top-down fabrication methods. In this study, we develop a surface treatment process by using an aminosilane molecule (di(isopropylamino)silane (DIPAS)) to block the adsorption of Hf precursors for AS-ALD HfO 2 . We show that under select conditions, functionalizing SiO 2 by DIPAS attaches only terminal silicon hydrides to the surface without addition of carbon. We test AS-ALD of HfO 2 on SiO 2 /TiN substrates using the DIPAS functionalization for three different Hf precursors (tetrakis(dimethylamino)hafnium(IV) (TDMAHf), hafnium(IV) tert -butoxide (Hf(O t Bu) 4 ), and hafnium tetrachloride (HfCl 4 )). After the growth characteristics and film properties for the three precursors are investigated, optimized ALD and surface functionalization processes are determined. Subsequent blocking results show that the resulting hydride-functionalized SiO 2 surface can prevent the adsorption of some Hf precursors, without the need for inhibitors based on carbon species at the surface. This study introduces a new surface treatment together with considerations for ALD precursor selection to enable an AS-ALD process that can be readily compatible with semiconductor manufacturing processes.