High quality full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam with burst mode
Kai Liao, Wenjun Wang, Xuesong Mei, Bin Liu
Topics & Concepts
Wafer dicingMaterials scienceOpticsLaser cuttingLaserMachiningSurface finishBeam (structure)Laser ablationAblationOptoelectronicsComposite materialAerospace engineeringEngineeringMetallurgyWaferPhysicsLaser Material Processing TechniquesLaser-induced spectroscopy and plasmaAdvanced Surface Polishing Techniques